Special Issue on Emerging Technologies on Semiconductor Devices, Circuits and Applications

Submission Deadline: Jun. 25, 2020

This special issue currently is open for paper submission and guest editor application.

Please download to know all details of the Special Issue

Special Issue Flyer (PDF)

  • Special Issue Editor
    • Zeheng Wang
      University of Electronic Science and Technology of China, Chengdu, China
    Guest Editors play a significant role in a special issue. They maintain the quality of published research and enhance the special issue’s impact. If you would like to be a Guest Editor or recommend a colleague as a Guest Editor of this special issue, please Click here to fulfill the Guest Editor application.
    • Yuanzhe Yao
      University of Electronic Science and Technology of China, Chengdu, China
    • wang yongsheng
      Taiyuan University of Technology, Taiyuan, Shanxi, China
    • Ashok Kumar K
      Department of ECE, Matrusri Engineering College, Osmania University, Hyderabad, Telangana, India
  • Introduction

    Electronics are playing a significant role in the modern technology including aerospace, computer, automation in industries, communication and home appliances. It’s impossible to realize these important circuits without electronics devices. When it comes to functioning of the electronic devices, different parameter counts such as fabrication technique, fabrication environment, active material incorporated in the device, size of the device, packing of the device. To discuss these emerging topics, this special issue of international journal of electrical and electronics engineering, a peer review journal, is going to emphasize on all classes of semiconductor devices and related materials, process and applications. This special issue accepts original research work based on both simulation and experiment.
    This issue calls for the experimental/simulation work/proposal based on different electronics devices incorporating different semiconductors. Some advanced circuits related to electrical and electronics can also be accepted. Further, this issue accepts the development of new fabrication and characterization techniques may be used for development of nano/micro devices.

    Subject areas for publication include:
    1. Si-based Nano/Micro Electronic devices.
    2. III-IV semiconductor devices.
    3. 2-D material Devices.
    4. Electronic Sensors
    5. Optoelectronics
    6. Solar cell
    7. Electromechanical system
    8. Organic and molecular electronics
    9. Electronic Circuits
    10. Fabrication process
    11. Measurement and characterization
    12. Simulation technology on electronic devices and circuits
    13. Modelling on electronic devices and circuits

    Aims and Scope:

    1. Semiconductors
    2. Electronic devices
    3. Fabrication processes
    4. Characterizations
    5. Simulations
    6. Modelling

  • Guidelines for Submission

    Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.

    Papers should be formatted according to the guidelines for authors (see: http://www.eeejournal.org/submission). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.

  • Published Papers

    The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.

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